International Conference on Science, Technology, Engineering and Management (ICSTEM - 2024) will be held on 27th-28th Dec 2024 at Osaka,Japan . ICSTEM is to bring together innovative academics and industrial experts in the field of Science, Technology, Engineering and Management to a common forum. All the registered papers will be published by the World Research Library and will be submitted for review for indexing by Google Scholar etc.
This Conference is sponsored by many International institutes. The conference would offer a large number of invited lectures from renowned speakers all over the country. The Best paper awards will be given for the papers judged to make the most significant contribution to the conference.
All submissions to the conference will be reviewed by at least two independent peers for technical merit and content. It is anticipated that a broad range of research and applied topics will be covered during the conference.
The papers will be published in the hardcopy of the Conference Proceedings (available online and print) with ISBN number and the same will be provided at the time of the conference. Later, the Proceedings shall be submitted to the major Indexing like ISI Thomson/SCOPUS, Google Scholar, etc. (* Cond. Applied) for review and possible indexing. In addition, the Online proceedings will be indexed at Google and Google Scholar and all major search engines.
Publication in Journal: The extended version of the registered papers will be forwarded for review and Publication in the Journals associated with Academicsera. (*Cond. Applied, Read the Rules Carefully)
Paper submission deadline |
12th Dec 2024 |
Last date of registration |
17th Dec 2024 |
Early Bird Registration |
12th November 2024 |
Date of Conference |
27th - 28th December 2024 |
Note
* Notification of acceptance or rejection for the submitted paper will be notified to you within 10 working days of submission date.
** If you are not getting any reply then, you can mail us to [email protected]. Mention your submitted Paper Code in the mail.
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